By Thomas E. Munns, James C. Seferis (auth.), Julian F. Johnson, Philip S. Gill (eds.)
This quantity five in a continual sequence represents the compilation of papers provided on the foreign Symposium on Analytical Calorimetry as a part of the 185th nationwide assembly of the yankee Chemical Society, Seattle, Washington, March 20-25th. 1983. a wider number of subject matters are lined than in pre vious volumes, a result of progress within the box of Thermal research. particular subject matters protecting such strategies as differential scanning calorimetry, mixed thermogravimetric tactics, dynamic mechan ical research and a number of novel kinetic analyses are lined. a variety of fabric varieties are integrated during this quantity comparable to polymers (alloys, blends and composites), fossil fuels, organic items, liquid crystals and inorganic fabrics. The co-editors of this quantity wish to thank all of the individuals for his or her efforts in conforming to the manuscript standards, and for being urged within the guidance. we might additionally wish to thank those that presided over classes in the course of the process the symposium; Professor Anselm C. Griffin, Professor Roger S. Porter and Dr. Edith A. Turi.
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Extra resources for Analytical Calorimetry: Volume 5
During lamination at elevated temperatures, the prepreg turns liquid; the viscosity decreases due to heating. In competition, the viscosity rises due to the molecular weight increase from the continuing propagation reaction. Eventually the latter effect takes over and an overall increase in viscosity results. As soon DEFINING 8-ST AGE AND TOTAL CURE 59 as the gel point is reached, the resin ceases to flow altogether. To generate a quality composite, it is important for the resin from the prepreg sheets to mix and to flow into the copper interface.
It is proposed to monitor calorimetric parameters via DSC and to exercize the appropriate controls for the production process based on these more fundamental and operator independent parameters. 57 B. K. APPELT AND P. J. COOK 58 INTRODUCTION Epoxy resins are presently the most widely used thermosets in the electronics industry. In "first level" packaging, they are used to encapsulate chips and modules providing environmental and electrical protection. In "second level" packaging, they serve as the mechanical support inside printed circuit (PC) cards or boards as well as dielectrics for the incorporated circuitry.
Gerald nuPre, Or. ~1ark Robillard, nr. Hugh Huffman and Dr. Michael Hadka of the Analytical Division of Exxon Research and Engineering Company, helpful discussions with Mr. Harvey Eo Rair of the Rell Laboratories, Murray Hill, New Jersey concerning water analysis in polymers, and information regarding the measurement of the glass transition temperature of HPAM, Kindly provided by Professor Dr. 1ein of the Institut fur Techni sche Chemi e, Techni sche Uni versitat Rraunschwei g. REFERENCES (1) Kulicke and J.
Analytical Calorimetry: Volume 5 by Thomas E. Munns, James C. Seferis (auth.), Julian F. Johnson, Philip S. Gill (eds.)